Base material

PI、PET

Thickness of base copper

18µm/35µm

Max panel size

single - 550mm x 250mm
double - 500mm x 250mm

Min hole diameter of drilling

ø 0.15mm / 6mil

Min hole diameter of punching

ø 0.5mm / 20mil

Min trace width/Min space

0.075mm (3mil)

Peel strength

1.0kg.f /cm

Multi-layers

Max 4 layers

Passive component

Min. 0201

Connector

Min. Pitch 0.3mm

Stiffener

PI, PET, FR4, Metal

Solder heat temp

PI：280°C

PET : 243℃

Surder heat temp

Gold plating： 1µ"~10µ"

Immersion Gold：1µ"~5µ"
OSP 
Immersion Tin：2µ" ~ 40µ" 
Tin plating：200µ"~1000µ"

Dimension of tolerances

Conductor Width：±0.03mm~±0.05mm

Outline Dimension：±0.1mm

Apply Coverlay Tolerance：±0.3mm

Hole Diameter：±0.1mm